IEC 61249-3-5:2009 pdf free download

IEC 61249-3-5:2009 pdf free download Materials for printed boards and other interconnecting structures – Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) – Transfer adhesive films
1Scope
This part of lEC 61249 gives requirements for transfer adhesive films for use in the fabricationof flexible multilayer boards or flex-rigid printed boards.
2Normative references
The following normative documents contain provisions which, through reference in this text,constitute provisions of this part of lEC 61249.For dated references,subsequent amendmentsto, or revisions of, any of these publications do not apply. However, parties to agreementsbased on this part of lEC 61249 are encouraged to investigate the possibility of applying
the most recent editions of the normative documents indicated below.For undated references,the latest edition of the normative document referred to applies. Members of lEC and lSO
maintain registers of currently valid International Standards.
IEC 60249-1:1982,Base materials for printed circuits – Part 1:Test methods
IEC 60249-2-8:1987,Base materials for printed circuits – Part 2: Specifications – SpecificationNo.8: Flexible copper-clad polyester (PETP) film
\IEC 60249-2-13:1987,Base materials for printed circuits – Part 2: Specifications -Specification No.13: Flexible copper-clad polyimide film, general purpose grade
IEC 60249-2-15:1987,Base materials for printed circuits – Part 2: Specifications -Specification No.15: Flexible copper-clad polyimide film of defined flammability
IEC 61189-2:1997,Test methods for electrical material interconnection structures andassemblies – Part 2:Test methods for materials for interconnection structures
3Materials and construction
The materials consist of adhesive layers based on B-staged epoxide, acrylic or polyester(PET)resin supported by a removable paper carrier and protected by a polymeric release film whichshall adhere until lamination.
The adhesive on epoxide or acrylic base shall be compatible with the copper-clad polyimidefilms according to iEC 60249-2-13 and IEC 60249-2-15; the adhesive on polyester (PET) baseshall be compatible with the copper-clad polyester films according to lEC 60249-2-8.
The thickness of the adhesive films shall be between 12,5 om and 75 om, with a permissibletolerance of +20 % when measured by the method of 3.14 of lEC 60249-1, provided that themicrometer used is capable of resolving 0,002 mm or better.Preferred thicknesses are 25 xmand 50 c.m.
Other thicknesses may be used by agreement between purchaser and supplier.
The thickness of the adhesive film is defined as follows:
Ta= Tt-Tp
where
Tais the thickness of the adhesive film;
Tis the average value of the total thickness of the material under test, including the paper carrier and protective material;
Tpis the average value of the thickness of the paper carrier and protective material.Thickness values Tt and Tp shall be measured as described in 3.14 of lEC 60249-1.
4lnternal marking
Not applicable.
5Designation
The following code shall be used to designate adhesive films according to this specification: