IEC 60749-15:2010 pdf free download

IEC 60749-15:2010 pdf free download Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
1Scope
This part of lEC 60749 describes a test used to determine whether encapsulated solid statedevices used for through-hole mounting can withstand the effects of the temperature to whichthey are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solderdip method is used because of its more controllable conditions. This procedure determineswhether devices are capable of withstanding the soldering temperature encountered in printedwiring board assembly operations,without degrading their electrical characteristics or internalconnections.
This test is destructive and may be used for qualification，lot acceptance and as a productmonitor.
This test is, in general, in conformity with lEC 60068-2-20 but, due to specific requirements ofsemiconductors, the clauses of this standard apply.
2 General
The heat is conducted through the leads into the device package from solder heat at thereverse side of the board.This procedure does not simulate wave soldering or reflow heatexposure on the same side of the board as the package body.
Test apparatus
3.1Solder pot
A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder potdimensions shall allow full immersion of the leads without touching the bottom.The apparatusshall be capable of maintaining the solder at the temperature specified in Table 1.
3.2Dipping device
A mechanical dipping device shall be used that is capable of controlling the rates ofimmersion and emersion of the leads and providing the dwell time as specified in Table 1.
3.3Heatsinks or shielding
lf applicable, heatsinks or shielding shall be attached to the devices prior to the test and shallbe as specified in the relevant specification.
Materials
4.1solder
The solder specification shall be as follows.Chemical composition
– for SnPb solder the composition in percentage by weight shall be as follows:
Tin:59 % to 65 %;
Lead:the remainder.Chemical composition
– for Pb-free solder the composition in percentage by weight shall be as follows:
Silver:3 % to 4 %;
Copper:0.5 % to 1 %;Tin:the remainder.
The solder shall not contain impurities which will adversely affect its properties.
Other solders and their applicable bath temperatures may be used as specified in the relevantspecification.
4.2Flux
lf flux is applied prior to solder dipping, the flux shall consist of 25 % by weight of colophonyin 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification.”
Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux prior to solder dip; excess flux shall be removed by draining for a suitable time.