IEC 62433-2:2008 pdf free download

IEC 62433-2:2008 pdf free download

IEC 62433-2:2008 pdf free download EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE)
1 scope
This part of lEC 62433 specifies macro-models for lCs to simulate conducted electromagneticemissions on a printed circuit board. The model is commonly called Integrated CircuitEmission Model – Conducted Emission (ICEM-CE).
The ICEM-CE model can also be used for modelling an IC-die,a functional block and anIntellectual Property block (IP).
The ICEM-CE model can be used to model both digital and analogue lCs.
Basically, conducted emissions have two origins:
conducted emissions through power supply terminals and ground reference structures;
conducted emissions through input/output (I/O) terminals.
The ICEM-CE model addresses those two types of origins in a single approach.
This standard defines structures and components of the macro-model for EMIl simulationtaking into account the lC’s internal activities.
This standard gives general data, which can be implemented in different formats or languagessuch as lBIS,MIC,SPICE,VHDL-AMS and Verilog.SPICE is however chosen as defaultsimulation environment to cover all the conducted emissions.
This standard also specifies requirements for information that shall be incorporated in eachICEM-CE model or component part of the model for model circulation, but description syntaxis not within the scope of this standard.
2Normative references
The following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies.For undated references, the latest editionof the referenced document (including any amendments) applies.
IEC 61967(all parts),Integrated Circuits – Measurement of electromagnetic emissions,150KHz to 1 GHz
IEC 61967-4,Integrated circuits – Measurement of electromagnetic emissions,150 kHz to 1GHz- Part 4 : Measurement of conducted emissions – 1 Q/150 Q direct coupling method
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
external terminal
terminal of an IC macro-model, which interfaces the model to the external environment of the IC, such as power supply pins and I/O pins
NOTE In this document, the name of each external terminal starts with “ET”.
internal terminal
terminal of an IC macro-model’s component, which interfaces the component to other components of the IC macro-model
NOTE In this document, the name of each internal terminal starts with “IT”.
4 Philosophy
4.1 General
Integrated circuits will have more and more gates on silicon and technical progress will develop faster. To predict the electromagnetic behaviour of equipment, it is required to model the switching of the input and output interface and the internal activities of an integrated circuit effectively.
Figure 1 depicts an example of decomposition of an IC to enable conducted emissions analysis. The internal digital activity (culprit) is a source of electromagnetic noise that originates in switching of active devices. The coupling path propagates the emissions to the IC’s external terminals: pins/pads. The coupling path is the power distribution network or I/O lines inside the IC.